IRF7309TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website
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IRF7309TRPBF Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2001
Series
HEXFET®
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Resistance
50mOhm
Additional Feature
ULTRA LOW RESISTANCE
Subcategory
Other Transistors
Max Power Dissipation
1.4W
Terminal Position
DUAL
Terminal Form
GULL WING
Current Rating
4A
Base Part Number
IRF7309PBF
Number of Elements
2
Row Spacing
6.3 mm
Operating Mode
ENHANCEMENT MODE
Power Dissipation
1.4W
FET Type
N and P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
50m Ω @ 2.4A, 10V
Vgs(th) (Max) @ Id
1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
520pF @ 15V
Current - Continuous Drain (Id) @ 25°C
4A 3A
Gate Charge (Qg) (Max) @ Vgs
25nC @ 4.5V
Polarity/Channel Type
N-CHANNEL AND P-CHANNEL
Turn-Off Delay Time
25 ns
Continuous Drain Current (ID)
4A
Threshold Voltage
1V
Gate to Source Voltage (Vgs)
20V
Drain Current-Max (Abs) (ID)
4A
Drain to Source Breakdown Voltage
30V
Pulsed Drain Current-Max (IDM)
16A
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Standard
Nominal Vgs
1 V
Height
1.4986mm
Length
4.9784mm
Width
4.05mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$0.332856
$0.332856
10
$0.314015
$3.14015
100
$0.296240
$29.624
500
$0.279472
$139.736
1000
$0.263653
$263.653
IRF7309TRPBF Product Details
IRF7309TRPBF Description
The fifth generation HEXFET of the International Rectifier Company uses advanced technology to achieve the lowest possible on-resistance area per silicon. This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rough device design, provides designers with an extremely efficient device used in a variety of applications.SO-8 has been improved through a customized framework to enhance thermal and multi-chip capabilities, making it ideal for a variety of power applications. Through these improvements, a variety of devices can be used in applications that greatly reduce circuit board space. Package design for gas phase, infrared or wave soldering technology in typical printed circuit board installation applications, it is possible to consume more than 0.8W.
IRF7309TRPBF Features
Generation Technology
UltraLowOn-Resistance
Dual Nand PChannel Mosfet
Surface Mount
Availablein Tape&Reel
Dynamic dv/dt Rating
Fast Switching Lead-Free
IRF7309TRPBF Applications
This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rough device design, provides designers with an extremely efficient device used in a variety of applications.