IRF7329TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website
SOT-23
IRF7329TRPBF Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2004
Series
HEXFET®
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
Voltage - Rated DC
-12V
Max Power Dissipation
2W
Terminal Form
GULL WING
Current Rating
-9.2A
Base Part Number
IRF7329PBF
Number of Elements
2
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2W
Turn On Delay Time
10 ns
FET Type
2 P-Channel (Dual)
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
17m Ω @ 9.2A, 4.5V
Vgs(th) (Max) @ Id
900mV @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
3450pF @ 10V
Gate Charge (Qg) (Max) @ Vgs
57nC @ 4.5V
Rise Time
8.6ns
Drain to Source Voltage (Vdss)
12V
Fall Time (Typ)
260 ns
Turn-Off Delay Time
340 ns
Continuous Drain Current (ID)
9.2A
Gate to Source Voltage (Vgs)
8V
Drain-source On Resistance-Max
0.017Ohm
Drain to Source Breakdown Voltage
-12V
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Logic Level Gate
Height
1.4986mm
Length
4.9784mm
Width
3.9878mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
4,000
$0.61087
$2.44348
8,000
$0.58367
$4.66936
12,000
$0.56425
$6.771
IRF7329TRPBF Product Details
IRF7329TRPBF Description
Intrative Rectifier's new P-channel HEXFET power MOSFET uses advanced technology to achieve extremely low on-resistance per silicon area. This advantage, combined with the well-known rugged device design of HEXFET Power MOSFET, provides designers with an extremely efficient and reliable device for use in a variety of applications.Over the years, SO-8 has been improved through customized thermal characteristics and multi-chip capabilities, making it an ideal choice for a variety of powerapplications.Withtheseimprovementsmultiple devices that can be used to greatly reduce circuit board space. The package is designed for gas phase, infrared or wave soldering technology.
IRF7329TRPBF Features
Trench Technology
Ultra Low On-Resistance
Dual P-Channel MOSFET
Low Profile (<1.8mm)
Available in Tape & Reel
Lead-Free
IRF7329TRPBF Applications
making it an ideal choice for a variety of powerapplications