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IRF7410PBF

IRF7410PBF

IRF7410PBF

Infineon Technologies

IRF7410PBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website

SOT-23

IRF7410PBF Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Surface Mount YES
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tube
Published 2006
Series HEXFET®
JESD-609 Code e3
Part Status Discontinued
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Additional Feature ULTRA LOW RESISTANCE
Subcategory Other Transistors
Technology MOSFET (Metal Oxide)
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 30
JESD-30 Code R-PDSO-G8
Qualification Status Not Qualified
Number of Elements 1
Configuration SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max 2.5W Ta
Operating Mode ENHANCEMENT MODE
FET Type P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 7m Ω @ 16A, 4.5V
Vgs(th) (Max) @ Id 900mV @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 8676pF @ 10V
Current - Continuous Drain (Id) @ 25°C 16A Ta
Gate Charge (Qg) (Max) @ Vgs 91nC @ 4.5V
Drain to Source Voltage (Vdss) 12V
Drive Voltage (Max Rds On,Min Rds On) 1.8V 4.5V
Vgs (Max) ±8V
JEDEC-95 Code MS-012AA
Drain Current-Max (Abs) (ID) 16A
Drain-source On Resistance-Max 0.007Ohm
Pulsed Drain Current-Max (IDM) 65A
DS Breakdown Voltage-Min 12V
RoHS Status ROHS3 Compliant
IRF7410PBF Product Details

Description


The IRF7410PBF is a -12V single P-channel HEXFET? Power MOSFET that uses innovative processing techniques to provide low on-resistance per silicon area. This advantage offers the designer a very efficient device for battery and load management applications. The package has been upgraded with a bespoke lead frame for improved thermal performance and multiple-die capability, making it suitable for a wide range of power applications. Multiple devices can now be used in an application while using up a lot less board space thanks to these enhancements. Vapour phase, infrared, and wave soldering techniques are all supported by the package.



Features


● Ultra low on-resistance

● MOSFET with P-Channel

● Surface mount

● Tape and reel versions are available

● Lead-Free



Applications


● Power Management

● Load Switching

● Industrial

● Automotive

● DC-DC Converters


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