IRF7410PBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
SOT-23
IRF7410PBF Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Surface Mount
YES
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tube
Published
2006
Series
HEXFET®
JESD-609 Code
e3
Part Status
Discontinued
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Additional Feature
ULTRA LOW RESISTANCE
Subcategory
Other Transistors
Technology
MOSFET (Metal Oxide)
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
[email protected] Reflow Temperature-Max (s)
30
JESD-30 Code
R-PDSO-G8
Qualification Status
Not Qualified
Number of Elements
1
Configuration
SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max
2.5W Ta
Operating Mode
ENHANCEMENT MODE
FET Type
P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
7m Ω @ 16A, 4.5V
Vgs(th) (Max) @ Id
900mV @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
8676pF @ 10V
Current - Continuous Drain (Id) @ 25°C
16A Ta
Gate Charge (Qg) (Max) @ Vgs
91nC @ 4.5V
Drain to Source Voltage (Vdss)
12V
Drive Voltage (Max Rds On,Min Rds On)
1.8V 4.5V
Vgs (Max)
±8V
JEDEC-95 Code
MS-012AA
Drain Current-Max (Abs) (ID)
16A
Drain-source On Resistance-Max
0.007Ohm
Pulsed Drain Current-Max (IDM)
65A
DS Breakdown Voltage-Min
12V
RoHS Status
ROHS3 Compliant
IRF7410PBF Product Details
Description
The IRF7410PBF is a -12V single P-channel HEXFET? Power MOSFET that uses innovative processing techniques to provide low on-resistance per silicon area. This advantage offers the designer a very efficient device for battery and load management applications. The package has been upgraded with a bespoke lead frame for improved thermal performance and multiple-die capability, making it suitable for a wide range of power applications. Multiple devices can now be used in an application while using up a lot less board space thanks to these enhancements. Vapour phase, infrared, and wave soldering techniques are all supported by the package.