IRF9952TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website
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IRF9952TRPBF Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2004
Series
HEXFET®
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Resistance
100mOhm
Additional Feature
HIGH RELIABILITY
Max Power Dissipation
2W
Terminal Position
DUAL
Terminal Form
GULL WING
Current Rating
3.5A
Base Part Number
IRF9952PBF
Number of Elements
2
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2W
FET Type
N and P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
100m Ω @ 2.2A, 10V
Vgs(th) (Max) @ Id
1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
190pF @ 15V
Current - Continuous Drain (Id) @ 25°C
3.5A 2.3A
Gate Charge (Qg) (Max) @ Vgs
14nC @ 10V
Rise Time
14ns
Polarity/Channel Type
N-CHANNEL AND P-CHANNEL
Turn-Off Delay Time
20 ns
Continuous Drain Current (ID)
3.5A
Threshold Voltage
1V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
30V
Pulsed Drain Current-Max (IDM)
16A
Avalanche Energy Rating (Eas)
44 mJ
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Logic Level Gate
Nominal Vgs
1 V
Height
1.4986mm
Length
4.9784mm
Width
3.9878mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead, Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
IRF9952TRPBF Product Details
IRF9952TRPBF Description
In the new generation of hexadecimal transistors, rectifiers use advanced processing technology to achieve extremely low on-resistance per silicon area. Combined with HEXFET Power MOSFET's well-known fast switching speed and rugged device design, it provides designers with an extremely efficient and reliable device for use in a variety of applications.The SO-8 has been modified through custom lead frames to enhance thermal characteristics and multi-chip capabilities, making it an ideal choice for a variety of powerapplications.Withtheseimprovementsmultiple devices that can be used to greatly reduce circuit board space. Infrared welding technology.
IRF9952TRPBF Features
Generation VTechnology Ultra Low On-Resistance
Dual N and P Channe MOSFET Surface Mount
Very Low Gate Charge and Switching Losses
Fully Avalanche Rated Lead-Free
IRF9952TRPBF Applications
it provides designers with an extremely efficient and reliable device for use in a variety of applications.