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FDC636P

FDC636P

FDC636P

ON Semiconductor

FDC636P datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website

SOT-23

FDC636P Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case SOT-23-6 Thin, TSOT-23-6
Supplier Device Package SuperSOT™-6
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 1998
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Technology MOSFET (Metal Oxide)
Power Dissipation-Max 1.6W Ta
FET Type P-Channel
Rds On (Max) @ Id, Vgs 130mOhm @ 2.8A, 4.5V
Vgs(th) (Max) @ Id 1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 390pF @ 10V
Current - Continuous Drain (Id) @ 25°C 2.8A Ta
Gate Charge (Qg) (Max) @ Vgs 8.5nC @ 4.5V
Drain to Source Voltage (Vdss) 20V
Drive Voltage (Max Rds On,Min Rds On) 2.5V 4.5V
Vgs (Max) ±8V
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $1.056253 $1.056253
10 $0.996464 $9.96464
100 $0.940061 $94.0061
500 $0.886850 $443.425
1000 $0.836651 $836.651
FDC636P Product Details

FDC636P   Description


  These P-channel logic level enhanced mode power field effect transistors are produced using Fairchild's proprietary high cell density DMOS technology. This very high-density process is particularly suitable for low-voltage applications, such as cellular phone and laptop power management and other battery-powered circuits, which require high-end switches and low line power consumption in a very small form factor surface mount package.

 

FDC636P   Features


-2.8A-20VRo=0.130Ω@Vs=-4.5V

RDSN=0.180Ω @VGs=-2.5V

SuperSOT -6 package design using copper lead frame for superior thermal and electrical capabilities

High density cell design for extremely low RSION)

Exceptional on-resistance and maximum DC current capability.

 

FDC636P    Applications


cellular phone and laptop power management

other battery-powered circuits

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