FDC636P datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website
SOT-23
FDC636P Datasheet
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Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
SOT-23-6 Thin, TSOT-23-6
Supplier Device Package
SuperSOT™-6
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
1998
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Technology
MOSFET (Metal Oxide)
Power Dissipation-Max
1.6W Ta
FET Type
P-Channel
Rds On (Max) @ Id, Vgs
130mOhm @ 2.8A, 4.5V
Vgs(th) (Max) @ Id
1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
390pF @ 10V
Current - Continuous Drain (Id) @ 25°C
2.8A Ta
Gate Charge (Qg) (Max) @ Vgs
8.5nC @ 4.5V
Drain to Source Voltage (Vdss)
20V
Drive Voltage (Max Rds On,Min Rds On)
2.5V 4.5V
Vgs (Max)
±8V
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1.056253
$1.056253
10
$0.996464
$9.96464
100
$0.940061
$94.0061
500
$0.886850
$443.425
1000
$0.836651
$836.651
FDC636P Product Details
FDC636P Description
These P-channel logic level enhanced mode power field effect transistors are produced using Fairchild's proprietary high cell density DMOS technology. This very high-density process is particularly suitable for low-voltage applications, such as cellular phone and laptop power management and other battery-powered circuits, which require high-end switches and low line power consumption in a very small form factor surface mount package.
FDC636P Features
-2.8A-20VRo=0.130Ω@Vs=-4.5V
RDSN=0.180Ω @VGs=-2.5V
SuperSOT -6 package design using copper lead frame for superior thermal and electrical capabilities
High density cell design for extremely low RSION)
Exceptional on-resistance and maximum DC current capability.