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NTMYS4D1N06CLTWG

NTMYS4D1N06CLTWG

NTMYS4D1N06CLTWG

ON Semiconductor

T6 60V LL LFPAK

SOT-23

NTMYS4D1N06CLTWG Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Factory Lead Time 33 Weeks
Mounting Type Surface Mount
Package / Case SOT-1023, 4-LFPAK
Operating Temperature-55°C~175°C TJ
PackagingTape & Reel (TR)
JESD-609 Code e3
Pbfree Code yes
Part StatusActive
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Terminal Finish Tin (Sn)
Technology MOSFET (Metal Oxide)
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reach Compliance Code not_compliant
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
Power Dissipation-Max 3.7W Ta 79W Tc
FET Type N-Channel
Rds On (Max) @ Id, Vgs 4m Ω @ 50A, 10V
Vgs(th) (Max) @ Id 2V @ 80μA
Input Capacitance (Ciss) (Max) @ Vds 2200pF @ 25V
Current - Continuous Drain (Id) @ 25°C 22A Ta 100A Tc
Gate Charge (Qg) (Max) @ Vgs 34nC @ 10V
Drain to Source Voltage (Vdss) 60V
Drive Voltage (Max Rds On,Min Rds On) 4.5V 10V
Vgs (Max) ±20V
In-Stock:2468 items

Pricing & Ordering

QuantityUnit PriceExt. Price
1$2.69000$2.69
500$2.6631$1331.55
1000$2.6362$2636.2
1500$2.6093$3913.95
2000$2.5824$5164.8
2500$2.5555$6388.75

About NTMYS4D1N06CLTWG

The NTMYS4D1N06CLTWG from ON Semiconductor is a high-performance microcontroller designed for a wide range of embedded applications. This component features T6 60V LL LFPAK.

Key Features

  • Advanced AVR architecture for efficient processing
  • Wide operating temperature range: -40°C to 85°C
  • Low power consumption for energy-efficient applications
  • Comprehensive peripheral set including SPI, UART, and USART interfaces

Applications

This microcontroller is ideal for various applications including:

  • Industrial control systems
  • Consumer electronics
  • Automotive systems
  • IoT devices
  • Medical equipment

Technical Support

Hotenda provides comprehensive technical support for the NTMYS4D1N06CLTWG, including datasheets, application notes, and design resources. Our team of engineers is available to assist with your design challenges.

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