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STFW3N150

STFW3N150

STFW3N150

STMicroelectronics

STFW3N150 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from STMicroelectronics stock available on our website

SOT-23

STFW3N150 Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 8 Weeks
Lifecycle Status ACTIVE (Last Updated: 7 months ago)
Contact Plating Tin
Mount Through Hole
Mounting Type Through Hole
Package / Case ISOWATT218FX
Number of Pins 3
Transistor Element Material SILICON
Operating Temperature 150°C TJ
Packaging Tube
Series PowerMESH™
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 3
ECCN Code EAR99
Resistance 9Ohm
Subcategory FET General Purpose Power
Technology MOSFET (Metal Oxide)
Base Part Number STFW
Pin Count 3
Number of Elements 1
Power Dissipation-Max 63W Tc
Element Configuration Single
Operating Mode ENHANCEMENT MODE
Power Dissipation 63W
Case Connection ISOLATED
Turn On Delay Time 24 ns
FET Type N-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 9 Ω @ 1.3A, 10V
Vgs(th) (Max) @ Id 5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 939pF @ 25V
Current - Continuous Drain (Id) @ 25°C 2.5A Tc
Gate Charge (Qg) (Max) @ Vgs 29.3nC @ 10V
Rise Time 47ns
Drain to Source Voltage (Vdss) 1500V
Drive Voltage (Max Rds On,Min Rds On) 10V
Vgs (Max) ±30V
Fall Time (Typ) 61 ns
Turn-Off Delay Time 45 ns
Continuous Drain Current (ID) 2.5A
Threshold Voltage 4V
Gate to Source Voltage (Vgs) 30V
Drain to Source Breakdown Voltage 1.5kV
Avalanche Energy Rating (Eas) 450 mJ
Height 26.7mm
Length 15.7mm
Width 5.7mm
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $3.264600 $3.2646
10 $3.079811 $30.79811
100 $2.905482 $290.5482
500 $2.741021 $1370.5105
1000 $2.585869 $2585.869
STFW3N150 Product Details

STFW3N150 Description


STFW3N150 is a type of PowerMESH power MOSFET developed by STMicroelectronics. It is designed utilizing the STMicroelectronics consolidated strip-layout-based MESH OVERLAY process. It can be found in the TO-3PF, H2PAK-2, TO-220, or TO247 packages with the purpose of saving board space. Based on its 100% avalanche tested, intrinsic capacitances and Qg minimized, and high-speed switching, STFW3N150 power MOSFET is well suited for various applications.



STFW3N150 Features


  • 100% avalanche tested

  • Intrinsic capacitances and Qg minimized

  • High-speed switching

  • Fully isolated TO-3PF plastic package, creepage distance path is 5.4 mm (typ.)



STFW3N150 Applications


  • Switching applications


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