CSD19536KTT datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Texas Instruments stock available on our website
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CSD19536KTT Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
6 Weeks
Lifecycle Status
ACTIVE (Last Updated: 1 day ago)
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
TO-263-4, D2Pak (3 Leads + Tab), TO-263AA
Number of Pins
3
Transistor Element Material
SILICON
Operating Temperature
-55°C~175°C TJ
Packaging
Tape & Reel (TR)
Series
NexFET™
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
2 (1 Year)
Number of Terminations
2
ECCN Code
EAR99
Additional Feature
AVALANCHE RATED
Technology
MOSFET (Metal Oxide)
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Base Part Number
CSD19536
Number of Elements
1
Number of Channels
1
Power Dissipation-Max
375W Tc
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
375W
Case Connection
DRAIN
Turn On Delay Time
13 ns
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
2.4m Ω @ 100A, 10V
Vgs(th) (Max) @ Id
3.2V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
12000pF @ 50V
Current - Continuous Drain (Id) @ 25°C
200A Ta
Gate Charge (Qg) (Max) @ Vgs
153nC @ 10V
Rise Time
8ns
Drive Voltage (Max Rds On,Min Rds On)
6V 10V
Vgs (Max)
±20V
Fall Time (Typ)
6 ns
Turn-Off Delay Time
32 ns
Continuous Drain Current (ID)
200A
Gate to Source Voltage (Vgs)
20V
Drain-source On Resistance-Max
0.0028Ohm
Drain to Source Breakdown Voltage
100V
Pulsed Drain Current-Max (IDM)
400A
Avalanche Energy Rating (Eas)
806 mJ
Max Junction Temperature (Tj)
175°C
Height
4.83mm
Length
10.18mm
Width
8.41mm
Thickness
4.44mm
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead
Pricing & Ordering
Quantity
Unit Price
Ext. Price
500
$2.89504
$1447.52
CSD19536KTT Product Details
Description
The CSD19536KTT is a NexFETTM Power MOSFET with a 100-V N-Channel. This NexFETTM power MOSFET with a 100-V, 2-m, D2PAK (TO-263) is designed to reduce losses in power conversion applications. MOSFET stands for metal oxide semiconductor field-effect transistor, and it is a form of MOSFET that is used to switch enormous amounts of current. The source and drain terminals are on opposing sides of the chip in power MOSFETs, which have a vertical configuration. The vertical design reduces gate crowding and allows for wider channel widths.