SI7938DP-T1-GE3 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Vishay Siliconix stock available on our website
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SI7938DP-T1-GE3 Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
14 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
PowerPAK® SO-8 Dual
Number of Pins
8
Weight
506.605978mg
Transistor Element Material
SILICON
Manufacturer Package Identifier
S17-0173-DUAL
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2014
Series
TrenchFET®
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
6
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Subcategory
FET General Purpose Power
Max Power Dissipation
46W
Terminal Form
C BEND
Peak Reflow Temperature (Cel)
260
Reach Compliance Code
unknown
[email protected] Reflow Temperature-Max (s)
40
Base Part Number
SI7938
Pin Count
8
JESD-30 Code
R-XDSO-C6
Qualification Status
Not Qualified
Number of Elements
2
Number of Channels
2
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
3.5W
Case Connection
DRAIN
Turn On Delay Time
11 ns
FET Type
2 N-Channel (Dual)
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
5.8m Ω @ 18.5A, 10V
Vgs(th) (Max) @ Id
2.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
2300pF @ 20V
Gate Charge (Qg) (Max) @ Vgs
65nC @ 10V
Rise Time
19ns
Drain to Source Voltage (Vdss)
40V
Fall Time (Typ)
15 ns
Turn-Off Delay Time
33 ns
Continuous Drain Current (ID)
60A
Threshold Voltage
2.5V
Gate to Source Voltage (Vgs)
20V
Drain to Source Breakdown Voltage
40V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj)
150°C
FET Feature
Standard
Nominal Vgs
2.5 V
Height
1.17mm
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
3,000
$0.79250
$2.3775
6,000
$0.76500
$4.59
SI7938DP-T1-GE3 Product Details
SI7938DP-T1-GE3 Description
The SI7938DP-T1-GE3 is a Dual N-Channel 40 V (D-S) MOSFET. A form of field-effect transistor (FET) called a metal-oxide-semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET) is most frequently made by carefully controlling the oxidation of silicon. It has an isolated gate, whose voltage controls the device's conductivity. Electronic signals can be switched or amplified using this material's capacity to change conductivity in response to the amount of applied voltage. Nearly the same thing as a MOSFET is a metal-insulator-semiconductor field-effect transistor (MISFET). IGFET, or insulated-gate field-effect transistor, is another equivalent term.
SI7938DP-T1-GE3 Features
TrenchFET® power MOSFET
100 % Rg and UIS tested
High current: The same tendency as for low ON resistance.
High Speed: U-MOS is disadvantageous for high-speed switching because of large gate capacity (Ciss).
Withstand voltage: The optimum structure is selected for the target withstand voltage.
Low On-Resistance: U-MOS for products with 250 V or less, SJ-MOS (or DTMOS) are advantageous for products with more than that.