FPGAs Virtex? UltraScale+? Series 2104-BBGA, FCBGA
SOT-23
XCVU9P-3FLGC2104E Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
13 Weeks
Mounting Type
Surface Mount
Package / Case
2104-BBGA, FCBGA
Operating Temperature
0°C~100°C TJ
Packaging
Tray
Series
Virtex® UltraScale+™
Part Status
Active
HTS Code
8542.39.00.01
Voltage - Supply
0.873V~0.927V
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Reach Compliance Code
not_compliant
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
Number of I/O
416
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells
2586150
Total RAM Bits
391168000
Number of LABs/CLBs
147780
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
XCVU9P-3FLGC2104E Product Details
XCVU9P-3FLGC2104E Overview
This package is included in the 2104-BBGA, FCBGA package and is available for purchase. This kind of FPGA is composed of FIELD PROGRAMMABLE GATE ARRAY. 416 I/Os are available for transferring data more efficiently. The basic building blocks of logic contain 2586150 logic elements/cells. By attaching the Surface Mount connector, you can use this FPGA module with your development board. Fpga chips operates wFpga chipsh a supply voltage of 0.873V~0.927V. FPGAs belonging to the Virtex? UltraScale+? series are a type of FPGA that belong to the Virtex? UltraScale+? series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin 0°C~100°C TJ when the device is operating. This FPGA model is contained in Tray for space saving. Fpga electronics is worth mentioning that this device provides 391168000 bfpga electronics s of RAM. The FPGA is built as an array of 147780 latches or CLBs.
XCVU9P-3FLGC2104E Features
416 I/Os Up to 391168000 RAM bits
XCVU9P-3FLGC2104E Applications
There are a lot of Xilinx Inc. XCVU9P-3FLGC2104E FPGAs applications.