BSZ215CHXTMA1 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website
SOT-23
BSZ215CHXTMA1 Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
18 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-PowerTDFN
Number of Pins
8
Transistor Element Material
SILICON
Operating Temperature
-55°C~175°C TJ
Packaging
Tape & Reel (TR)
Published
2014
Series
Automotive, AEC-Q101, OptiMOS™
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
5
Terminal Finish
Tin (Sn)
Additional Feature
AVALANCHE RATED
Max Power Dissipation
2.5W
Terminal Position
DUAL
Terminal Form
NO LEAD
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
S-PDSO-N5
Number of Elements
2
Configuration
SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE
Operating Mode
ENHANCEMENT MODE
Case Connection
DRAIN
FET Type
N and P-Channel Complementary
Rds On (Max) @ Id, Vgs
55m Ω @ 5.1A, 4.5V
Vgs(th) (Max) @ Id
1.4V @ 110μA
Halogen Free
Halogen Free
Input Capacitance (Ciss) (Max) @ Vds
419pF @ 10V
Current - Continuous Drain (Id) @ 25°C
5.1A 3.2A
Gate Charge (Qg) (Max) @ Vgs
2.8nC @ 4.5V
Drain to Source Voltage (Vdss)
20V
Polarity/Channel Type
N-CHANNEL AND P-CHANNEL
Continuous Drain Current (ID)
3.2A
Max Dual Supply Voltage
-20V
Drain Current-Max (Abs) (ID)
5.1A
Drain-source On Resistance-Max
0.055Ohm
Pulsed Drain Current-Max (IDM)
20A
Avalanche Energy Rating (Eas)
11 mJ
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Logic Level Gate, 2.5V Drive
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
5,000
$0.51205
$2.56025
BSZ215CHXTMA1 Product Details
BSZ215CHXTMA1 Description
Fifth Generation HEXFETs from International Rectifier feature an incredibly low on-resistance per silicon area because to innovative production processes. In addition to the high switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for, this feature gives the design an extremely efficient and reliable device for usage in a range of applications. Thanks to its improved thermal properties and multiple-die capacity, the SO-8 is the best choice for a variety of power applications. This alteration was made feasible by the use of a lead frame that was specially created. This invention allows for the usage of several devices while requiring noticeably less board space. The package is designed to function with wave or vapor phase infrared soldering methods.