FZ250R65KE3NPSA1 datasheet pdf and Transistors - IGBTs - Modules product details from Infineon Technologies stock available on our website
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FZ250R65KE3NPSA1 Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
20 Weeks
Mount
Screw
Mounting Type
Chassis Mount
Package / Case
Module
Number of Pins
5
Operating Temperature
-50°C~125°C
Published
2002
Pbfree Code
no
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
ECCN Code
EAR99
Subcategory
Insulated Gate BIP Transistors
Number of Elements
1
Configuration
Single
Power - Max
4800W
Halogen Free
Not Halogen Free
Input
Standard
Collector Emitter Voltage (VCEO)
6.5kV
Max Collector Current
250A
Current - Collector Cutoff (Max)
5mA
Voltage - Collector Emitter Breakdown (Max)
6500V
Current - Collector (Ic) (Max)
500A
Power Dissipation-Max (Abs)
4800W
Vce(on) (Max) @ Vge, Ic
3.4V @ 15V, 250A
NTC Thermistor
No
Gate-Emitter Voltage-Max
20V
Input Capacitance (Cies) @ Vce
69nF @ 25V
VCEsat-Max
3.4 V
RoHS Status
Non-RoHS Compliant
Lead Free
Contains Lead
Pricing & Ordering
Quantity
Unit Price
Ext. Price
4
$1,371.50750
$4
FZ250R65KE3NPSA1 Product Details
FZ250R65KE3NPSA1 Description
The FZ250R65KE3NPSA1 is a highly insulated module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode. Insulated-gate bipolar transistor, or IGBT, is a type of power semiconductor die. The physical construction and packaging of multiple IGBT power semiconductor dies into a single package is known as an IGBT power module.
FZ250R65KE3NPSA1 Features
Electrical Features
Low VCEsat
Mechanical Features
Package with enhanced insulation of 10.4kV AC 10s
High creepage and clearance distances
Package with CTI > 600
AlSiC base plate for increased thermal cycling capability