IRF7304 datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website
SOT-23
IRF7304 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Surface Mount
YES
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tube
Published
1997
Series
HEXFET®
JESD-609 Code
e0
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Terminal Finish
Tin/Lead (Sn/Pb)
Additional Feature
LOGIC LEVEL COMPATIBLE
HTS Code
8541.29.00.95
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
245
[email protected] Reflow Temperature-Max (s)
30
JESD-30 Code
R-PDSO-G8
Qualification Status
Not Qualified
Number of Elements
2
Configuration
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
Operating Mode
ENHANCEMENT MODE
Power - Max
2W
FET Type
2 P-Channel (Dual)
Rds On (Max) @ Id, Vgs
90m Ω @ 2.2A, 4.5V
Vgs(th) (Max) @ Id
700mV @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
610pF @ 15V
Current - Continuous Drain (Id) @ 25°C
4.3A
Gate Charge (Qg) (Max) @ Vgs
22nC @ 4.5V
Drain to Source Voltage (Vdss)
20V
Drain Current-Max (Abs) (ID)
3.6A
Drain-source On Resistance-Max
0.09Ohm
DS Breakdown Voltage-Min
20V
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Logic Level Gate
RoHS Status
Non-RoHS Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1.38000
$1.38
95
$0.95611
$90.83045
190
$0.91532
$173.9108
570
$0.85118
$485.1726
IRF7304 Product Details
IRF7304 Description
The fifth generation HEXFET of International Rectifier Company uses advanced technology to achieve minimum on-resistance, combines the well-known fast switching speed and rugged device design of HEXFET power MOSFET, and provides designers with an extremely efficient device used in a variety of applications.
The SO-8 has been improved by customizing lead frames to enhance thermal properties and a variety of capabilities to handle a variety of power applications. With these improvements, multiple devices can be used in one application while reducing circuit board space. The package is designed for vapor phase infrared. Or wave soldering technology in typical printed circuit board placement applications, power consumption of more than 0.8W is possible.
IRF7304 Features
GenerationVTechnology
Ultra Low On-Resistance
DualP-Channel Mosfet Surface Mount
Available in Tape&Reel
Dynamic dv/dt Rating
Fast Switching
IRF7304 Applications
provides designers with an extremely efficient device used in a variety of applications.