IRF7507TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website
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IRF7507TRPBF Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Number of Pins
8
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
1998
Series
HEXFET®
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Resistance
270mOhm
Terminal Finish
Matte Tin (Sn)
Additional Feature
ULTRA LOW RESISTANCE
Max Power Dissipation
1.25W
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
[email protected] Reflow Temperature-Max (s)
40
Base Part Number
IRF7507PBF
Number of Elements
2
Operating Mode
ENHANCEMENT MODE
Power Dissipation
1.25W
FET Type
N and P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
140m Ω @ 1.7A, 4.5V
Vgs(th) (Max) @ Id
700mV @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
260pF @ 15V
Current - Continuous Drain (Id) @ 25°C
2.4A 1.7A
Gate Charge (Qg) (Max) @ Vgs
8nC @ 4.5V
Polarity/Channel Type
N-CHANNEL AND P-CHANNEL
Turn-Off Delay Time
38 ns
Continuous Drain Current (ID)
2.4A
Threshold Voltage
700mV
Gate to Source Voltage (Vgs)
12V
Drain to Source Breakdown Voltage
20V
Pulsed Drain Current-Max (IDM)
19A
FET Technology
METAL-OXIDE SEMICONDUCTOR
FET Feature
Logic Level Gate
Nominal Vgs
700 mV
Height
860μm
Length
3mm
Width
3mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$0.230279
$0.230279
10
$0.217244
$2.17244
100
$0.204947
$20.4947
500
$0.193347
$96.6735
1000
$0.182402
$182.402
IRF7507TRPBF Product Details
IRF7507TRPBF Description
The fifth generation HEXFET of International Rectifier Company adopts advanced technology to achieve extremely low on-resistance per silicon area. This advantage, combined with HEXFET Power MOSFET's well-known fast switching speed and rugged device design, provides designers with an extremely efficient and reliable device for use in a variety of applications. The new Micro8 package covers only half the footprint of the standard SO-8, making it the smallest footprint available in the SOIC outline. This makes Micro8 an ideal device for applications with limited space on printed circuit boards. The ultra-thin shape of the Micro8 (< 1.1 mm) makes it easy to adapt to extremely thin application environments, such as portable electronics and PCMCIA cards.