IRG4PC30WPBF datasheet pdf and Transistors - IGBTs - Single product details from Infineon Technologies stock available on our website
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IRG4PC30WPBF Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
14 Weeks
Mount
Through Hole
Mounting Type
Through Hole
Package / Case
TO-247-3
Number of Pins
3
Weight
38.000013g
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Bulk
Published
2000
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
3
Termination
Through Hole
ECCN Code
EAR99
Additional Feature
LOW CONDUCTION LOSS
Subcategory
Insulated Gate BIP Transistors
Voltage - Rated DC
600V
Max Power Dissipation
100W
Terminal Position
SINGLE
Current Rating
23A
Number of Elements
1
Element Configuration
Dual
Power Dissipation
100W
Case Connection
COLLECTOR
Input Type
Standard
Transistor Application
POWER CONTROL
Rise Time
16ns
Polarity/Channel Type
N-CHANNEL
Collector Emitter Voltage (VCEO)
2.7V
Max Collector Current
23A
JEDEC-95 Code
TO-247AC
Collector Emitter Breakdown Voltage
600V
Collector Emitter Saturation Voltage
2.7V
Turn On Time
41 ns
Test Condition
480V, 12A, 23 Ω, 15V
Vce(on) (Max) @ Vge, Ic
2.7V @ 15V, 12A
Turn Off Time-Nom (toff)
300 ns
Gate Charge
51nC
Current - Collector Pulsed (Icm)
92A
Td (on/off) @ 25°C
25ns/99ns
Switching Energy
130μJ (on), 130μJ (off)
Gate-Emitter Voltage-Max
20V
Gate-Emitter Thr Voltage-Max
6V
Fall Time-Max (tf)
100ns
Height
20.2946mm
Length
15.875mm
Width
5.3mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
RoHS Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$3.431008
$3.431008
10
$3.236800
$32.368
100
$3.053585
$305.3585
500
$2.880740
$1440.37
1000
$2.717680
$2717.68
IRG4PC30WPBF Product Details
Description
The IRG4PC30WPBF is an Insulated Gate Bipolar Transistor (IGBT). An insulated-gate bipolar transistor (IGBT) is a three-terminal power semiconductor device principally used as an electronic switch that has evolved to combine high efficiency and fast switching as it has been developed. It consists of four alternating layers (P–N–P–N) that are controlled by a metal–oxide–semiconductor (MOS) gate structure.
Features
● 50% reduction of Eoff parameter
● Low IGBT conduction losses
● Latest-generation IGBT design and construction offers tighter parameters distribution, exceptional reliability
● Lead-Free
● Designed expressly for Switch-Mode Power Supply and PFC (power factor correction) applications
● Industry-benchmark switching losses improve efficienty of all power supply topologies