IRGIB15B60KD1P datasheet pdf and Transistors - IGBTs - Single product details from Infineon Technologies stock available on our website
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IRGIB15B60KD1P Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
16 Weeks
Mount
Through Hole
Mounting Type
Through Hole
Package / Case
TO-220-3 Full Pack
Number of Pins
3
Weight
2.299997g
Transistor Element Material
SILICON
Operating Temperature
-55°C~175°C TJ
Packaging
Tube
Published
2004
Part Status
Last Time Buy
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
3
ECCN Code
EAR99
Subcategory
Insulated Gate BIP Transistors
Voltage - Rated DC
600V
Max Power Dissipation
52W
Current Rating
12A
Number of Elements
1
Element Configuration
Single
Power Dissipation
52W
Case Connection
ISOLATED
Input Type
Standard
Transistor Application
MOTOR CONTROL
Rise Time
35ns
Polarity/Channel Type
N-CHANNEL
Collector Emitter Voltage (VCEO)
2.2V
Max Collector Current
19A
Reverse Recovery Time
67 ns
JEDEC-95 Code
TO-220AB
Collector Emitter Breakdown Voltage
600V
Collector Emitter Saturation Voltage
1.8V
Turn On Time
55 ns
Test Condition
400V, 15A, 22 Ω, 15V
Vce(on) (Max) @ Vge, Ic
2.2V @ 15V, 15A
Turn Off Time-Nom (toff)
250 ns
IGBT Type
NPT
Gate Charge
56nC
Current - Collector Pulsed (Icm)
38A
Td (on/off) @ 25°C
30ns/173ns
Switching Energy
127μJ (on), 334μJ (off)
Gate-Emitter Voltage-Max
20V
Gate-Emitter Thr Voltage-Max
5.5V
Height
16.12mm
Length
10.63mm
Width
4.83mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$4.47000
$4.47
50
$3.83320
$191.66
100
$3.36000
$336
500
$2.90278
$1451.39
IRGIB15B60KD1P Product Details
IRGIB15B60KD1P Description
IRGIB15B60KD1P is an insulated gate bipolar transistor with an ultrafast soft recovery diode manufactured by Infineon Technologies. It's made for mid-frequency applications and responds swiftly to provide the user the most bang for their buck. To give the best IGBT transistors, the IRGIB15B60KD1P uses FRED optimized diodes, and itis composed of silicon to decrease switching and conduction losses for higher efficiency, reduced heat concerns, and improved power density, according to IRGIB15B60KD1P datasheet.
The IRGIB15B60KD1P was created with medium to high power modules in mind. A Solderable Front Metal (SFM) die can be used to eliminate connecting wires in modules that require the highest dependability, allowing for double-sided cooling for increased thermal performance, reliability, and efficiency.