Description

A HEXFET? Power MOSFET is the IRLL024NTRPBF. Advanced processing techniques are used in Fifth Generation HEXFETs to obtain extraordinarily low on-resistance per silicon area. This benefit, when paired with the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for, gives the designer an exceptionally efficient and dependable device that can be used in a wide range of applications.

The SOT-223 is a surface-mount package that may be soldered using vapor phase, infrared, or wave soldering processes. Its one-of-a-kind package design enables for effortless automatic pick-and-place, just like other SOT or SOIC packages, but with the extra benefit of increased thermal performance thanks to an expanded heat sinking tab. In a typical surface mount application, the power dissipation of 1.0W is attainable.

Features

● Ultra Low On-Resistance

● Dynamic dv/dt Rating

● Fully Avalanche Rated

● Fast Switching

● Surface Mount

● Advanced Process Technology

● Lead-Free

Applications

● In various radio and RF applications

● Transportation technology

● Automotive industry

● Power MOSFETs

● Consumer electronics