FDC6333C datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from ON Semiconductor stock available on our website
SOT-23
FDC6333C Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
10 Weeks
Lifecycle Status
ACTIVE (Last Updated: 2 days ago)
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
SOT-23-6 Thin, TSOT-23-6
Number of Pins
6
Weight
36mg
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
2017
Series
PowerTrench®
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
6
ECCN Code
EAR99
Resistance
95MOhm
Subcategory
Other Transistors
Max Power Dissipation
960mW
Terminal Form
GULL WING
Current Rating
2.5A
Number of Elements
2
Number of Channels
2
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
960mW
Turn On Delay Time
4.5 ns
Power - Max
700mW
FET Type
N and P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
95m Ω @ 2.5A, 10V
Vgs(th) (Max) @ Id
3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
282pF @ 15V
Current - Continuous Drain (Id) @ 25°C
2.5A 2A
Gate Charge (Qg) (Max) @ Vgs
6.6nC @ 10V
Rise Time
13ns
Drain to Source Voltage (Vdss)
30V
Polarity/Channel Type
N-CHANNEL AND P-CHANNEL
Fall Time (Typ)
13 ns
Turn-Off Delay Time
11 ns
Continuous Drain Current (ID)
2.5A
Threshold Voltage
1.8V
Gate to Source Voltage (Vgs)
25V
Drain to Source Breakdown Voltage
-30V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Max Junction Temperature (Tj)
150°C
FET Feature
Logic Level Gate
Nominal Vgs
1.8 V
Height
1mm
Length
3mm
Width
1.7mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
3,000
$0.17647
$0.52941
6,000
$0.16508
$0.99048
15,000
$0.15370
$2.3055
30,000
$0.14573
$4.3719
FDC6333C Product Details
FDC6333C Description
The FDC6333C is an N/P-channel MOSFET produced using an advanced PowerTrench? process. The Onsemi FDC6333C has been specially tailored to minimize ON-state resistance and yet maintain superior switching performance. It has been designed to offer exceptional power dissipation in a very small footprint for applications where the bigger more expensive packages are impractical. The MOSFET FDC6333C is suitable for use with DC-to-DC converter, load switch, and LCD display inverter applications. The FDC6333C is offered in the SOT-23-3 package. It is specified for operation from –55°C to +150°C.
FDC6333C Features
Q1 2.5 A, 30V
RDS(on) = 95 mΩ@ VGS = 10 V
RDS(on) = 150 mΩ @ VGS = 4.5 V
Q2 –2.0 A, 30V.
RDS(on) = 150 mΩ@ VGS = -10 V
RDS(on) = 220 mΩ @ VGS = -4.5 V
Low gate charge
High-performance trench technology for extremely low RDS(ON)
SuperSOT –6 package: small footprint (72% smaller than SO-8); low profile (1mm thick).