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NTD5802NT4G

NTD5802NT4G

NTD5802NT4G

ON Semiconductor

NTD5802NT4G datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website

SOT-23

NTD5802NT4G Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 14 Weeks
Lifecycle Status ACTIVE (Last Updated: 1 day ago)
Mounting Type Surface Mount
Package / Case TO-252-3, DPak (2 Leads + Tab), SC-63
Surface Mount YES
Number of Pins 3
Transistor Element Material SILICON
Operating Temperature -55°C~175°C TJ
Packaging Tape & Reel (TR)
Published 2007
JESD-609 Code e3
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
ECCN Code EAR99
Terminal Finish Tin (Sn)
Subcategory FET General Purpose Power
Technology MOSFET (Metal Oxide)
Terminal Form GULL WING
Pin Count 3
JESD-30 Code R-PSSO-G2
Number of Elements 1
Power Dissipation-Max 2.5W Ta 93.75W Tc
Element Configuration Single
Operating Mode ENHANCEMENT MODE
Power Dissipation 93.75W
Case Connection DRAIN
Turn On Delay Time 14 ns
FET Type N-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 4.4m Ω @ 50A, 10V
Vgs(th) (Max) @ Id 3.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds 5025pF @ 25V
Current - Continuous Drain (Id) @ 25°C 16.4A Ta 101A Tc
Gate Charge (Qg) (Max) @ Vgs 100nC @ 10V
Rise Time 52ns
Drive Voltage (Max Rds On,Min Rds On) 5V 10V
Vgs (Max) ±20V
Fall Time (Typ) 8.5 ns
Turn-Off Delay Time 39 ns
Continuous Drain Current (ID) 16.4A
Gate to Source Voltage (Vgs) 20V
Drain-source On Resistance-Max 0.0078Ohm
Drain to Source Breakdown Voltage 40V
Avalanche Energy Rating (Eas) 240 mJ
Height 2.38mm
Length 6.73mm
Width 6.22mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
2,500 $0.59984 $1.19968
5,000 $0.57150 $2.8575
12,500 $0.55126 $6.61512
NTD5802NT4G Product Details

NTD5802NT4G Overview


The MOSFET's breakdown is called "avalanche break down", and the avalanche energy applied to transistor is rated as 240 mJ (Eas).The input capacitance parameter, CI, is defined as the capacitance between the input terminals of an op amp with either input grounded, and this device's maximal input capacitance is 5025pF @ 25V.Devices can conduct a maximum continuous current of 3 amps in the drain area, so the continuous drain current (ID) for this device is 16.4A amps.Single MOSFETs transistor is the voltage at which VDS flows at a specified ID value, wSingle MOSFETs transistorh VGS=40V, and this device has a drain-to-source breakdown voltage of 40V voltage.Turn-Off delay time?is?the time taken to charge the input capacitance of the device before drain current conduction can start, and its turn-off delay time is 39 ns.Input capacitance charge delays drain current conduction until the time it takes to charge input capacitance reaches 14 ns.Single MOSFETs transistor is the voltage across the gate-source terminal of a transistor that determines the gate-source voltage, VGS.By using drive voltage (5V 10V), this device helps reduce its overall power consumption.

NTD5802NT4G Features


the avalanche energy rating (Eas) is 240 mJ
a continuous drain current (ID) of 16.4A
a drain-to-source breakdown voltage of 40V voltage
the turn-off delay time is 39 ns

NTD5802NT4G Applications


There are a lot of ON Semiconductor NTD5802NT4G applications of single MOSFETs transistors.

  • Micro Solar Inverter
  • LCD/LED TV
  • Power Management Functions
  • Motor control
  • Solar Inverter
  • Lighting
  • Motor drives and Uninterruptible Power Supplies
  • DC/DC converters
  • DC-to-DC converters
  • Motor Drives and Uninterruptible Power Supples

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