NTD5802NT4G datasheet pdf and Transistors - FETs, MOSFETs - Single product details from ON Semiconductor stock available on our website
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NTD5802NT4G Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
14 Weeks
Lifecycle Status
ACTIVE (Last Updated: 1 day ago)
Mounting Type
Surface Mount
Package / Case
TO-252-3, DPak (2 Leads + Tab), SC-63
Surface Mount
YES
Number of Pins
3
Transistor Element Material
SILICON
Operating Temperature
-55°C~175°C TJ
Packaging
Tape & Reel (TR)
Published
2007
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
2
ECCN Code
EAR99
Terminal Finish
Tin (Sn)
Subcategory
FET General Purpose Power
Technology
MOSFET (Metal Oxide)
Terminal Form
GULL WING
Pin Count
3
JESD-30 Code
R-PSSO-G2
Number of Elements
1
Power Dissipation-Max
2.5W Ta 93.75W Tc
Element Configuration
Single
Operating Mode
ENHANCEMENT MODE
Power Dissipation
93.75W
Case Connection
DRAIN
Turn On Delay Time
14 ns
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
4.4m Ω @ 50A, 10V
Vgs(th) (Max) @ Id
3.5V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
5025pF @ 25V
Current - Continuous Drain (Id) @ 25°C
16.4A Ta 101A Tc
Gate Charge (Qg) (Max) @ Vgs
100nC @ 10V
Rise Time
52ns
Drive Voltage (Max Rds On,Min Rds On)
5V 10V
Vgs (Max)
±20V
Fall Time (Typ)
8.5 ns
Turn-Off Delay Time
39 ns
Continuous Drain Current (ID)
16.4A
Gate to Source Voltage (Vgs)
20V
Drain-source On Resistance-Max
0.0078Ohm
Drain to Source Breakdown Voltage
40V
Avalanche Energy Rating (Eas)
240 mJ
Height
2.38mm
Length
6.73mm
Width
6.22mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
NTD5802NT4G Product Details
NTD5802NT4G Overview
The MOSFET's breakdown is called "avalanche break down", and the avalanche energy applied to transistor is rated as 240 mJ (Eas).The input capacitance parameter, CI, is defined as the capacitance between the input terminals of an op amp with either input grounded, and this device's maximal input capacitance is 5025pF @ 25V.Devices can conduct a maximum continuous current of 3 amps in the drain area, so the continuous drain current (ID) for this device is 16.4A amps.Single MOSFETs transistor is the voltage at which VDS flows at a specified ID value, wSingle MOSFETs transistorh VGS=40V, and this device has a drain-to-source breakdown voltage of 40V voltage.Turn-Off delay time?is?the time taken to charge the input capacitance of the device before drain current conduction can start, and its turn-off delay time is 39 ns.Input capacitance charge delays drain current conduction until the time it takes to charge input capacitance reaches 14 ns.Single MOSFETs transistor is the voltage across the gate-source terminal of a transistor that determines the gate-source voltage, VGS.By using drive voltage (5V 10V), this device helps reduce its overall power consumption.
NTD5802NT4G Features
the avalanche energy rating (Eas) is 240 mJ a continuous drain current (ID) of 16.4A a drain-to-source breakdown voltage of 40V voltage the turn-off delay time is 39 ns
NTD5802NT4G Applications
There are a lot of ON Semiconductor NTD5802NT4G applications of single MOSFETs transistors.