IRF7493PBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
SOT-23
IRF7493PBF Datasheet
non-compliant
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Surface Mount
YES
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tube
Published
2003
Series
HEXFET®
JESD-609 Code
e3
Part Status
Discontinued
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Subcategory
FET General Purpose Power
Technology
MOSFET (Metal Oxide)
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
NOT SPECIFIED
[email protected] Reflow Temperature-Max (s)
NOT SPECIFIED
JESD-30 Code
R-PDSO-G8
Qualification Status
Not Qualified
Number of Elements
1
Configuration
SINGLE WITH BUILT-IN DIODE
Power Dissipation-Max
2.5W Tc
Operating Mode
ENHANCEMENT MODE
FET Type
N-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
15m Ω @ 5.6A, 10V
Vgs(th) (Max) @ Id
4V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
1510pF @ 25V
Current - Continuous Drain (Id) @ 25°C
9.3A Tc
Gate Charge (Qg) (Max) @ Vgs
53nC @ 10V
Drain to Source Voltage (Vdss)
80V
Drive Voltage (Max Rds On,Min Rds On)
10V
Vgs (Max)
±20V
JEDEC-95 Code
MS-012AA
Drain Current-Max (Abs) (ID)
9.3A
Drain-source On Resistance-Max
0.015Ohm
Pulsed Drain Current-Max (IDM)
74A
DS Breakdown Voltage-Min
80V
Avalanche Energy Rating (Eas)
180 mJ
RoHS Status
ROHS3 Compliant
IRF7493PBF Product Details
IRF7493PBF Description
N-channel devices are available in surface mount and lead-free packages in the Infineon line of discrete HEXFET? power MOSFETs. Moreover, there are form factors that can handle virtually any board layout and thermal design difficulty. Conduction losses are reduced by the across-the-board norm on resistance, enabling designers to provide systems with the highest possible efficiency.