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IRFHM9391TRPBF

IRFHM9391TRPBF

IRFHM9391TRPBF

Infineon Technologies

IRFHM9391TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website

SOT-23

IRFHM9391TRPBF Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-PowerTDFN
Number of Pins 8
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2013
Series HEXFET®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 5
ECCN Code EAR99
Subcategory Other Transistors
Technology MOSFET (Metal Oxide)
Terminal Position DUAL
Terminal Form FLAT
JESD-30 Code S-PDSO-F5
Number of Elements 1
Configuration SINGLE WITH BUILT-IN DIODE
Number of Channels 1
Power Dissipation-Max 2.6W Ta
Operating Mode ENHANCEMENT MODE
Power Dissipation 2.6W
Case Connection DRAIN
Turn On Delay Time 11 ns
FET Type P-Channel
Transistor Application SWITCHING
Rds On (Max) @ Id, Vgs 14.6m Ω @ 11A, 10V
Vgs(th) (Max) @ Id 2.4V @ 25μA
Input Capacitance (Ciss) (Max) @ Vds 1543pF @ 25V
Current - Continuous Drain (Id) @ 25°C 11A Ta
Gate Charge (Qg) (Max) @ Vgs 16nC @ 10V
Rise Time 27ns
Drain to Source Voltage (Vdss) 30V
Drive Voltage (Max Rds On,Min Rds On) 4.5V 10V
Vgs (Max) ±25V
Fall Time (Typ) 60 ns
Turn-Off Delay Time 72 ns
Continuous Drain Current (ID) 11A
Threshold Voltage -1.8V
Gate to Source Voltage (Vgs) 25V
Drain-source On Resistance-Max 0.0225Ohm
Drain to Source Breakdown Voltage -30V
Pulsed Drain Current-Max (IDM) 90A
Avalanche Energy Rating (Eas) 75 mJ
Radiation Hardening No
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
4,000 $0.33255 $1.3302
8,000 $0.31205 $2.4964
12,000 $0.30181 $3.62172
28,000 $0.29622 $8.29416
IRFHM9391TRPBF Product Details

IRFHM9391TRPBF Description


STripFETTM F7 technology is used in these N-channel Power MOSFETs, which has an enhanced trench gate structure that minimizes internal capacitance and gate charge for faster and more efficient switching. Lowering conduction loss, improving switching performance, increasing dv/dt rate, and increasing avalanche energy are all goals of this technology.



IRFHM9391TRPBF Features


  • PCB Thermal Resistance (3.8°C/W) is low.

  • i1.05 mm) Low Profile

  • Standard Pinout in the Industry

  • Compatible with Current Surface Mounting Methodologies

  • Halogen Free, RoHS Compliant

  • -Free

  • Consumer Qualification (MSL1)



IRFHM9391TRPBF Applications


Switching applications



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