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IRG4BC30FD-STRR

IRG4BC30FD-STRR

IRG4BC30FD-STRR

Infineon Technologies

IRG4BC30FD-STRR datasheet pdf and Transistors - IGBTs - Single product details from Infineon Technologies stock available on our website

SOT-23

IRG4BC30FD-STRR Datasheet

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Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case TO-263-3, D2Pak (2 Leads + Tab), TO-263AB
Surface Mount YES
Transistor Element Material SILICON
Operating Temperature -55°C~150°C TJ
Packaging Tape & Reel (TR)
Published 2004
JESD-609 Code e3
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 2
Terminal Finish Matte Tin (Sn) - with Nickel (Ni) barrier
Subcategory Insulated Gate BIP Transistors
Terminal Position SINGLE
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
[email protected] Reflow Temperature-Max (s) 30
JESD-30 Code R-PSSO-G2
Qualification Status Not Qualified
Number of Elements 1
Configuration SINGLE WITH BUILT-IN DIODE
Case Connection COLLECTOR
Input Type Standard
Power - Max 100W
Transistor Application POWER CONTROL
Polarity/Channel Type N-CHANNEL
Reverse Recovery Time 42ns
Voltage - Collector Emitter Breakdown (Max) 600V
Current - Collector (Ic) (Max) 31A
Power Dissipation-Max (Abs) 100W
Turn On Time 69 ns
Test Condition 480V, 17A, 23 Ω, 15V
Vce(on) (Max) @ Vge, Ic 1.8V @ 15V, 17A
Turn Off Time-Nom (toff) 620 ns
Gate Charge 51nC
Current - Collector Pulsed (Icm) 120A
Td (on/off) @ 25°C 42ns/230ns
Switching Energy 630μJ (on), 1.39mJ (off)
Gate-Emitter Voltage-Max 20V
Gate-Emitter Thr Voltage-Max 6V
Fall Time-Max (tf) 230ns
RoHS Status Non-RoHS Compliant
IRG4BC30FD-STRR Product Details

IRG4BC30FD-STRR  Benefits

Generation 4 IGBT's offer the highest efficiency available.

IGBT's optimized for specific application conditions.

HEXFRED diodes optimized for performance with IGBTs. Minimized recovery characteristics require less/no snubbing.

Designed to be a "drop-in" replacement for equivalent industry-standard Generation 3 IR IGBTs.



IRG4BC30FD-STRR  Features

Fast: optimized for medium operating frequencies (1-5 kHz in hard switching, >20kHz in resonant mode).

Generation 4 IGBT design provides tighter parameter distribution and higher eficiency than Generation 3.

IGBT co-packaged with HEXFREDTM ultrafast, ultra-soft recovery anti-parallel diodes for use in bridge configurations.

Lead-Free


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