IRLML5103TR datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Infineon Technologies stock available on our website
SOT-23
IRLML5103TR Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Mounting Type
Surface Mount
Package / Case
TO-236-3, SC-59, SOT-23-3
Surface Mount
YES
Transistor Element Material
SILICON
Packaging
Cut Tape (CT)
Published
2003
Series
HEXFET®
JESD-609 Code
e3
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
3
ECCN Code
EAR99
Terminal Finish
Matte Tin (Sn)
Additional Feature
LOGIC LEVEL COMPATIBLE
HTS Code
8541.21.00.95
Subcategory
Other Transistors
Technology
MOSFET (Metal Oxide)
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
[email protected] Reflow Temperature-Max (s)
30
JESD-30 Code
R-PDSO-G3
Qualification Status
Not Qualified
Operating Temperature (Max)
150°C
Operating Temperature (Min)
-55°C
Number of Elements
1
Configuration
SINGLE WITH BUILT-IN DIODE
Operating Mode
ENHANCEMENT MODE
FET Type
P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
600m Ω @ 600mA, 10V
Vgs(th) (Max) @ Id
1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
75pF @ 25V
Current - Continuous Drain (Id) @ 25°C
760mA Ta
Gate Charge (Qg) (Max) @ Vgs
5.1nC @ 10V
Drain to Source Voltage (Vdss)
30V
Drain Current-Max (Abs) (ID)
0.76A
Drain-source On Resistance-Max
0.6Ohm
DS Breakdown Voltage-Min
30V
Power Dissipation-Max (Abs)
0.28W
RoHS Status
Non-RoHS Compliant
IRLML5103TR Product Details
IRLML5103TR Description
International Rectifier's Fifth Generation HEXFETs use innovative processing techniques to provide ultra-low on-resistance per silicon area. This benefit, when paired with the quick switching speed and ruggedized device architecture that HEXFET Power MOSFETs are known for, gives the designer an exceptionally efficient and dependable device that can be used in a wide range of applications. To build a HEXFET Power MOSFET with the industry's smallest footprint, a bespoke leadframe has been put into the conventional SOT-23 packaging. The Micro3 package is designed for situations where printed circuit board space is limited. The Micro3's tiny profile (1.1mm) allows it to readily fit into ultra-thin application contexts like portable devices and PCMCIA cards.