CSD23201W10 datasheet pdf and Transistors - FETs, MOSFETs - Single product details from Texas Instruments stock available on our website
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CSD23201W10 Datasheet
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Specifications
Name
Value
Type
Parameter
Contact Plating
Copper, Silver, Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
4-UFBGA, DSBGA
Number of Pins
4
Transistor Element Material
SILICON
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Series
NexFET™
JESD-609 Code
e1
Pbfree Code
no
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
4
Termination
SMD/SMT
ECCN Code
EAR99
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory
Other Transistors
Technology
MOSFET (Metal Oxide)
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Base Part Number
CSD23201
Pin Count
4
Number of Elements
1
Configuration
SINGLE WITH BUILT-IN DIODE AND RESISTOR
Power Dissipation-Max
1W Ta
Operating Mode
ENHANCEMENT MODE
Power Dissipation
1W
Turn On Delay Time
24 ns
FET Type
P-Channel
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
82m Ω @ 500mA, 4.5V
Vgs(th) (Max) @ Id
1V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
325pF @ 6V
Current - Continuous Drain (Id) @ 25°C
2.2A Tc
Gate Charge (Qg) (Max) @ Vgs
2.4nC @ 4.5V
Rise Time
19ns
Drive Voltage (Max Rds On,Min Rds On)
1.5V 4.5V
Fall Time (Typ)
29 ns
Turn-Off Delay Time
68 ns
Continuous Drain Current (ID)
2.2A
Threshold Voltage
600mV
Gate to Source Voltage (Vgs)
-6V
Drain to Source Breakdown Voltage
12V
Dual Supply Voltage
12V
Nominal Vgs
600 mV
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$0.513125
$0.513125
10
$0.484080
$4.8408
100
$0.456679
$45.6679
500
$0.430829
$215.4145
1000
$0.406443
$406.443
CSD23201W10 Product Details
CSD23201W10 Description
The device's design aims to produce the lowest gate charge and on-resistance while maintaining outstanding thermal properties in an extremely low profile. This technology attempts to increase avalanche energy, increase dv/dt rate, decrease conduction loss, and improve switching performance. In addition to a significant reduction in on-resistance, these devices are designed to ensure a high level of dv/dt capability for the most demanding applications.