IRF7103TRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available on our website
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IRF7103TRPBF Datasheet
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Specifications
Name
Value
Type
Parameter
Factory Lead Time
12 Weeks
Contact Plating
Tin
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
8-SOIC (0.154, 3.90mm Width)
Number of Pins
8
Transistor Element Material
SILICON
Manufacturer Package Identifier
IRF7103TRPBF
Operating Temperature
-55°C~150°C TJ
Packaging
Tape & Reel (TR)
Published
1997
Series
HEXFET®
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
Termination
SMD/SMT
ECCN Code
EAR99
Resistance
130mOhm
Additional Feature
LOGIC LEVEL COMPATIBLE
Subcategory
FET General Purpose Power
Voltage - Rated DC
50V
Max Power Dissipation
2W
Terminal Form
GULL WING
Current Rating
3A
Base Part Number
IRF7103PBF
Number of Elements
2
Row Spacing
6.3 mm
Element Configuration
Dual
Operating Mode
ENHANCEMENT MODE
Power Dissipation
2W
Turn On Delay Time
5.1 ns
FET Type
2 N-Channel (Dual)
Transistor Application
SWITCHING
Rds On (Max) @ Id, Vgs
130m Ω @ 3A, 10V
Vgs(th) (Max) @ Id
3V @ 250μA
Input Capacitance (Ciss) (Max) @ Vds
290pF @ 25V
Gate Charge (Qg) (Max) @ Vgs
30nC @ 10V
Rise Time
8ns
Fall Time (Typ)
25 ns
Turn-Off Delay Time
15 ns
Continuous Drain Current (ID)
3A
Threshold Voltage
3V
Gate to Source Voltage (Vgs)
20V
Drain Current-Max (Abs) (ID)
3A
Drain to Source Breakdown Voltage
50V
Dual Supply Voltage
50V
FET Technology
METAL-OXIDE SEMICONDUCTOR
Recovery Time
100 ns
FET Feature
Standard
Nominal Vgs
3 V
Height
1.4986mm
Length
4.9784mm
Width
3.9878mm
Radiation Hardening
No
REACH SVHC
No SVHC
RoHS Status
ROHS3 Compliant
Lead Free
Contains Lead, Lead Free
Pricing & Ordering
Quantity
Unit Price
Ext. Price
1
$1.103513
$1.103513
10
$1.041050
$10.4105
100
$0.982123
$98.2123
500
$0.926531
$463.2655
1000
$0.874086
$874.086
IRF7103TRPBF Product Details
IRF7103TRPBF Description
The IRF7103TRPBF is a dual N-channel MOSFET that may be soldered using vapor phase, infrared, or wave methods. It has been updated with a bespoke lead frame for improved thermal performance and dual-die capabilities, making it suitable for a wide range of power applications. Multiple devices can be employed in an application with significantly less board space thanks to these enhancements.